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Wrap tool - メーカー・企業と業務用製品 | イプロスものづくり

Wrap toolの製品一覧

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Fixed abrasive lap tools for shortening SiC processing time.

Efficient flat processing of silicon carbide, a difficult-to-machine material. It aims to shorten processing time while stabilizing precision simultaneously.

In the flat lapping processing of SiC (silicon carbide), the length of processing time, variation in flatness, and the management burden of processing conditions are significant challenges. The fixed abrasive tool "Briemur" is a diamond tool developed to support the improvement of processing hard and difficult-to-machine materials. Compared to free abrasive processing (slurry method), it is less affected by the condition of the abrasives, making precision management easier and contributing to stable processing. Additionally, by maintaining an efficient processing rate, a reduction in lead time can be expected. It helps in building processes aimed at improving productivity and ensuring quality consistency in SiC processing. 【Features】 ■ Compatible with flat lapping processing for hard ceramics such as SiC ■ Supports the maintenance of processing rate and stabilization of precision through fixed abrasives ■ Reduces the burden of slurry management and contributes to a clean processing environment ■ Contributes to improved yield of expensive materials through stable finishing ■ Numerous processing achievements with hard materials, from small diameters to large workpieces *For more details, please refer to the related links or feel free to contact us.

  • Wafer processing/polishing equipment
  • Wrap tool

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Fixed abrasive lap tool corresponding to the orientation of each face of sapphire processing.

Stable processing of sapphire flat surfaces with different machinability for each face orientation using fixed abrasive grains.

In sapphire flat lapping processing, differences in machinability depending on the surface orientation often lead to challenges with processing time and variations in finish. Buriemur is a fixed abrasive tool designed for flat lapping specifically for sapphire processing. Its robust cutting ability with a fixed abrasive method supports the adjustment of processing conditions according to each surface orientation, helping to achieve both processing efficiency and stable precision. It has a proven track record with both large and small diameter workpieces and can be utilized for a wide range of processing from prototyping to mass production. 【Features】 ■ Compatible with sapphire processing for each surface orientation ■ Supports improved processing rates and stabilized precision through a fixed abrasive method ■ Contributes to reduced variation through condition adjustments for each surface orientation ■ Capable of handling workpieces from large to small diameters ■ Usable for a wide range of processing from prototyping to mass production *For more details, please refer to the related links or feel free to contact us.

  • Wafer processing/polishing equipment
  • Wrap tool

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録